The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2012
Filed:
Jan. 28, 2008
Christian Val, St Remy les Chevreuse, FR;
Christian Val, St Remy les Chevreuse, FR;
3D Plus, , FR;
Abstract
The invention relates to a method of interconnecting electronic components of a first wafer (T) with electronic components of a second wafer (T), each wafer having metallized vias () which pass through the wafer in the thickness direction. The method includes deposition of a drop () of conductive ink containing solvents on each via () of the first wafer (T); stacking of the second wafer (T) on the first so that the vias () of the second wafer (T) are substantially superposed on the vias () of the first wafer (T); removal of 50 to 90% of the solvents contained in the drops () by heating or applying a vacuum, so as to obtain a pasty ink; and laser sintering of the pasty ink drops () so as to produce electrical connections () between the superposed metallized vias ().