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For the Inventor, By the Inventor

Fuernitz, Austria

Christian Fachmann

This inventor holds 32 USPTO granted patents and 15 published patent applications and 8 EPO patents, primarily in Semiconductor Technology. Top assignees: Infineon Technologies Austria Ag, Infineon Technologies Ag, Infineon Technologies Dresden Gmbh & Co . Kg. Active years: 2012-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christian Fachmann. Retrieved from https://idiyas.com/inventor/christian-fachmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 32 

% Patents Active = 96.9

 

Average Co-Inventor Count = 3.1

ph-index = 2

Forward Citations = 19(Granted Patents)


Location History:

  • Fürnitz, AT (2017 - 2018)
  • Fuernitz, AT (2012 - 2024)

Company Filing History:

goldMedal25 out of 2,196 
 
Infineon Technologies Austria Ag
 patents
silverMedal6 out of 15,023 
 
Infineon Technologies Ag
 patents
bronzeMedal1 out of 61 
 
Infineon Technologies Dresden Gmbh & Co . Kg
 patents

Years Active: 2012-2026

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Areas of Expertise:
Power Semiconductor Device
Multi-Die Package
Transistor Circuit
Superjunction Device
Charge Compensation
Insulation Layer
Chip-Substrate Composite
Wiring Structure
Thermal Pathway
Field-Effect Device
Switchable Regions
Local Cell Geometry
32 patents (USPTO):Explore Patents
1. 12721245 - Power semiconductor device (2026-08-25),
2. 12525499 - Method of manufacturing semiconductor chips having a side wall sealing (2026-01-13),
3. 12424501 - Semiconductor package including a chip-substrate composite semiconductor device (2025-09-23),
4. 12368052 - Chip-substrate composite semiconductor device (2025-07-22),
5. 12273098 - Method for operating a power transistor circuit (2025-04-08),
6. 12176172 - Power relay circuit (2024-12-24),
7. 12014973 - Multi-die-package and method (2024-06-18),
8. 11869966 - Method for forming an insulation layer in a semiconductor body and transistor device (2024-01-09),
9. 11527468 - Semiconductor oxide or glass based connection body with wiring structure (2022-12-13),
10. 11508841 - Semiconductor device (2022-11-22),
11. 11329126 - Method of manufacturing a superjunction semiconductor device (2022-05-10),
12. 11211483 - Method for forming an insulation layer in a semiconductor body and transistor device (2021-12-28),
13. 11139125 - Power relay circuit (2021-10-05),
14. 11088275 - Method for operating a superjunction transistor device (2021-08-10),
15. 11081430 - Multi-die-package and method (2021-08-03),

Title: The Innovative Mind of Christian Fachmann

Introduction: Christian Fachmann, a talented inventor hailing from Fuernitz, Austria, is known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Christian Fachmann's most recent patents include a cutting-edge smart home automation system that has revolutionized the way people interact with their living spaces. This patent showcases his commitment to creating solutions that enhance everyday life.

Career Highlights: With a career spanning over two decades, Christian Fachmann has established himself as a visionary in the tech industry. His work has been instrumental in shaping the future of smart technology, with a focus on sustainability and efficiency.

Collaborations: Throughout his career, Christian Fachmann has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly with teams of experts has led to the successful development and implementation of innovative technologies.

Conclusion: Christian Fachmann's passion for innovation and his dedication to pushing the boundaries of what is possible have solidified his reputation as a pioneering inventor in the tech world. His continued commitment to creating cutting-edge solutions ensures that his legacy will endure for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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