The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2022

Filed:

Sep. 12, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Andreas Riegler, Lichtpold, AT;

Christian Fachmann, Fuernitz, AT;

Matteo-Alessandro Kutschak, Ludmannsdorf, AT;

Carsten von Koblinski, Villach, AT;

Hans Weber, Bayerisch Gmain, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/15 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/4846 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 24/08 (2013.01); H01L 24/89 (2013.01); H01L 24/97 (2013.01); H01L 2224/08237 (2013.01); H01L 2224/80001 (2013.01);
Abstract

A connection body which comprises a base structure at least predominantly made of a semiconductor oxide material or glass material, and an electrically conductive wiring structure on and/or in the base structure, wherein the electrically conductive wiring structure comprises at least one vertical wiring section with a first lateral dimension on and/or in the base structure and at least one lateral wiring section connected with the at least one vertical wiring section, wherein the at least one lateral wiring section has a second lateral dimension on and/or in the base structure, which is different to the first lateral dimension.


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