Choongbin Yim is a prominent inventor based in Cheonan-si, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His work focuses on innovative semiconductor packages and manufacturing methods that enhance performance and reliability.

Latest Patents

Among his latest patents is a groundbreaking semiconductor package and manufacturing method. This invention includes a package substrate, a semiconductor chip mounted above it, and a chip connection terminal interposed between the two. An adhesive layer covers the semiconductor chip and surrounds the chip connection terminal, while a molding layer encases the adhesive layer. Additionally, an interposer is mounted on the adhesive layer and molding layer, featuring a conductive pillar that connects the package substrate to the interposer substrate. Another notable patent involves a semiconductor package that consists of two package substrates, a semiconductor chip, and a series of metal core structures that connect the upper and lower surface pads without overlapping.

Career Highlights

Choongbin Yim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of semiconductor technology. His innovative designs and methods have positioned him as a key player in the industry, contributing to advancements that benefit various applications.

Collaborations

Throughout his career, Yim has collaborated with talented individuals such as Jongbo Shim and Jihwang Kim. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Choongbin Yim's contributions to semiconductor technology through his numerous patents highlight his role as an influential inventor. His work at Samsung Electronics Co., Ltd. continues to shape the future of the industry.

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