The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2026

Filed:

Jul. 28, 2023
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Choongbin Yim, Suwon-si, KR;

Jiyong Park, Suwon-si, KR;

Jinwoo Park, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/52 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 25/0652 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32146 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/1052 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1811 (2013.01);
Abstract

A semiconductor package includes a first redistribution structure; a third redistribution structure electrically connected to the first redistribution structure; a first semiconductor chip disposed between the first redistribution structure and the third redistribution structure; a second semiconductor chip disposed between the first redistribution structure and the third redistribution structure; and a second redistribution structure disposed between the second semiconductor chip and the first redistribution structure, wherein the first semiconductor chip does not overlap the second redistribution structure in a direction in which the first redistribution structure and the third redistribution structure face each other.


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