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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chih-Yuan Chang

This inventor holds 23 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Yuan Chang. Retrieved from https://idiyas.com/inventor/chih-yuan-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 91.3

Average Co-Inventor Count = 5.1

ph-index = 5

Forward Citations = 136(Granted Patents)


Location History:

  • Banqiao, TW (2006)
  • Hsinchu, CN (2021)
  • Hsinchu, TW (2016 - 2024)

Company Filing History:

goldMedal23 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2024

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Areas of Expertise:
Inductor Structure
Semiconductor Package
Fabrication Method
Rigid-Flexible Substrate
Optical Semiconductor
Cross-Talk Reduction
Heat Transfer Structures
Integrated Fan-Out Package
Voltage Regulators
Queue-Time Control
Abnormality Detection
23 patents (USPTO):Explore Patents
1. 12074122 - Inductor structure, semiconductor package and fabrication method thereof (2024-08-27),
2. 12040281 - Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof (2024-07-16),
3. 11830841 - Semiconductor package and method for manufacturing the same (2023-11-28),
4. 11658134 - Inductor structure, semiconductor package and fabrication method thereof (2023-05-23),
5. 11562926 - Package structure and method of forming thereof (2023-01-24),
6. 11322470 - Optical semiconductor package and method for manufacturing the same (2022-05-03),
7. 11302649 - Semiconductor device with shielding structure for cross-talk reduction (2022-04-12),
8. 11195817 - Semiconductor package and manufacturing method thereof (2021-12-07),
9. 11094634 - Semiconductor package structure comprising rigid-flexible substrate and manufacturing method thereof (2021-08-17),
10. 11075136 - Heat transfer structures and methods for IC packages (2021-07-27),
11. 11063016 - Integrated fan-out package including voltage regulators and methods forming same (2021-07-13),
12. 10763164 - Package structure with inductor and method of forming thereof (2020-09-01),
13. 10692817 - Semiconductor device with shielding structure for cross-talk reduction (2020-06-23),
14. 10665560 - Optical semiconductor package and method for manufacturing the same (2020-05-26),
15. 10559517 - Heat transfer structures and methods for IC packages (2020-02-11),

Title: The Innovative Journey of Chih-Yuan Chang

Introduction:

Chih-Yuan Chang, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chang's latest patents focus on advancements in semiconductor technology, particularly in the development of cutting-edge microchips with enhanced processing capabilities and efficiency.

Career Highlights:

With a career spanning over two decades, Chih-Yuan Chang has held key roles in leading tech companies, where he spearheaded research and development projects that have revolutionized the industry. His work has been instrumental in shaping the future of electronics and computing.

Collaborations:

Throughout his career, Chang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and excellence. His collaborative efforts have led to the successful implementation of groundbreaking technologies in various applications.

Conclusion:

In conclusion, Chih-Yuan Chang's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a visionary inventor in the field of semiconductor technology. His contributions continue to inspire future generations of inventors and shape the landscape of the tech industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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