The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2023
Filed:
Apr. 26, 2022
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chuei-Tang Wang, Taichung, TW;
Chih-Chieh Chang, Hsinchu, TW;
Yu-Kuang Liao, Hsinchu, TW;
Hsing-Kuo Hsia, Hsinchu County, TW;
Chih-Yuan Chang, Hsinchu, TW;
Jeng-Shien Hsieh, Kaohsiung, TW;
Chen-Hua Yu, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor package includes an interconnect structure, an insulating layer and a conductive layer. The interconnect structure includes a first surface and a second surface opposite to the first surface. The insulating layer contacts the interconnect structure. The insulating layer includes a third surface contacting the second surface of the interconnect structure and a fourth surface opposite to the third surface. The conductive layer is electrically coupled to the interconnect structure. The conductive layer has a continuous portion extending from the second surface to the fourth surface.