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Hsing-Kuo Hsia

USPTO Granted Patents = 78 (Patent Applications = 69)

Average Co-Inventor Count = 3.8

ph-index = 8

Forward Citations = 246(Granted Patents)

Forward Citations (Not Self Cited) = 211(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (2016)
Hsin Chu County, TW (2015 - 2023)
Jhubei, TW (2012 - 2024)

Company Filing History:

53 out of 40,780

Taiwan Semiconductor Manufacturing Comp. Ltd.

TSMC Solid State Lighting Ltd.

Epistar Corporation

Years Active: 2012-2025

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Areas of Expertise:

Photonic Semiconductor Device

Optical Transceiver

Thermo-Electric Cooler

Hybrid Integrated Circuit Package

Optical Signal Processing

Integrated Circuit Package

Grating Coupler

Optical Devices

3DIC Technology

Semiconductor Packages

Dicing-Free LED Fabrication

LED Integrated Lighting Module

78 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12504654 - Photonic semiconductor-insulator-semiconductor modulator and methods for forming the same (2025-12-23),

2. 12455420 - Photonic semiconductor device and method of manufacture (2025-10-28),

3. 12442978 - Photonic package and method of manufacture (2025-10-14),

4. 12422635 - Thermo-electric cooler for dissipating heat of optical engine (2025-09-23),

5. 12392961 - Structure and process for photonic packages (2025-08-19),

6. 12368146 - Hybrid integrated circuit packages (2025-07-22),

7. 12353011 - Photonic package and method of manufacture (2025-07-08),

8. 12306036 - Optical devices and methods of manufacture (2025-05-20),

9. 12294002 - Integrated circuit package and method of forming same (2025-05-06),

10. 12259578 - Photonic semiconductor device and method of manufacture (2025-03-25),

11. 12253729 - Optical transceiver and manufacturing method thereof (2025-03-18),

12. 12242108 - Photonic semiconductor device and method of manufacture (2025-03-04),

13. 12135454 - Structure and process for photonic packages (2024-11-05),

14. 12092861 - Photonic semiconductor device and method of manufacture (2024-09-17),

15. 12068297 - Hybrid integrated circuit package (2024-08-20),

Title: The Innovative Journey of Inventor Hsing-Kuo Hsia

Introduction: Hsing-Kuo Hsia, a talented inventor hailing from Jhubei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hsing-Kuo Hsia's latest patents focus on advancements in renewable energy technologies, particularly in the field of solar power efficiency and energy storage solutions.

Career Highlights: With a career spanning over two decades, Hsing-Kuo Hsia has established himself as a leading figure in the tech industry, with a strong focus on sustainability and environmental impact.

Collaborations: Throughout his career, Hsing-Kuo Hsia has collaborated with various research institutions and universities to further his research and bring his innovative ideas to life. His partnerships have led to the development of cutting-edge technologies that have the potential to shape the future of renewable energy.

Conclusion: Hsing-Kuo Hsia's passion for innovation and commitment to creating a more sustainable world have solidified his position as a respected inventor in the global tech community. His work continues to inspire and drive progress in the field of renewable energy.

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