The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2026
Filed:
Nov. 12, 2023
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Chen-Hua Yu, Hsinchu, TW;
Hsing-Kuo Hsia, Jhubei, TW;
Chih-Wei Tseng, Hsinchu, TW;
Jiun Yi Wu, Zhongli, TW;
Szu-Wei Lu, Hsinchu, TW;
Jui Lin Chao, New Taipei, TW;
Taiwan Semiconductor Manufacturing Company Limited, Hsinchu, TW;
Abstract
A photonic assembly includes: a composite die including a photonic integrated circuits (PIC) die and an electronic integrated circuits (EIC) die, the PIC die including waveguides and photonic devices therein, and the EIC die including semiconductor devices therein; an optical connector unit including a first connector-side mirror reflector and a first transition edge coupler and attached to a top surface of the composite die, wherein the first connector-side mirror reflector is configured to change a beam direction between a vertically-extending beam path through the composite die and a horizontally-extending beam path through the first transition edge coupler; and a fiber array units assembly attached to a sidewall of the optical connector unit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile