The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 2026
Filed:
Mar. 28, 2023
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01S 5/02315 (2021.01); H01S 5/0232 (2021.01); H01S 5/02345 (2021.01); H01S 5/028 (2006.01); H10B 80/00 (2023.01); H10W 20/20 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H01S 5/02315 (2021.01); H01S 5/0232 (2021.01); H01S 5/02345 (2021.01); H01S 5/028 (2013.01); H10W 20/20 (2026.01); H10W 90/754 (2026.01);
Abstract
Optical devices and methods of manufacture are presented in which an opening is formed within a first semiconductor device and then bonded to other optical devices. A laser die or other fill material may be used to refill the opening. The first semiconductor device is then electrically connected to an optical interposer.