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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chih-Chieh Chang

This inventor holds 30 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Au Optronics Corporation, Applied Materials Israel Limited. Active years: 2009-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chih-Chieh Chang. Retrieved from https://idiyas.com/inventor/chih-chieh-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 30 

% Patents Active = 96.7

Average Co-Inventor Count = 4.9

ph-index = 4

Forward Citations = 54(Granted Patents)


Location History:

  • Gueishan Township, Taoyuan County, TW (2009)
  • Taoyuan County, TW (2010)
  • Hsinchu County, TW (2020 - 2022)
  • Hsinchu, TW (2010 - 2023)
  • Zhubei, TW (2021 - 2023)

Company Filing History:

goldMedal26 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal3 out of 4,577 
 
Au Optronics Corporation
 patents
bronzeMedal1 out of 572 
 
Applied Materials Israel Limited
 patents

Years Active: 2009-2026

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Areas of Expertise:
Through-Substrate-Via Cell
Chemical Mechanical Polish Slurry
Photonic Semiconductor Device
Semiconductor Device Structure
Epitaxy Metrology
Hybrid Interconnect Device
Optical Semiconductor Package
Liquid Crystal Display Panel
Package Assembly
Manufacturing Method
Interconnect Structure
30 patents (USPTO):Explore Patents
1. 12707955 - Through-substrate-via cell (2026-08-11),
2. 12345935 - Package assembly and manufacturing method thereof (2025-07-01),
3. 12327734 - Chemical mechanical polish slurry and method of manufacture (2025-06-10),
4. 12249542 - Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the same (2025-03-11),
5. 12174415 - Semiconductor package and manufacturing method thereof (2024-12-24),
6. 12100698 - Semiconductor device and manufacturing method thereof (2024-09-24),
7. 11854872 - Semiconductor device structure with interconnect structure and method for forming the same (2023-12-26),
8. 11850704 - Methods to clean chemical mechanical polishing systems (2023-12-26),
9. 11841541 - Package assembly and manufacturing method thereof (2023-12-12),
10. 11830864 - Photonic semiconductor device and method (2023-11-28),
11. 11830841 - Semiconductor package and method for manufacturing the same (2023-11-28),
12. 11605622 - Photonic semiconductor device and method (2023-03-14),
13. 11460633 - Semiconductor package and manufacturing method thereof (2022-10-04),
14. 11455715 - Epitaxy metrology in fin field effect transistors (2022-09-27),
15. 11446785 - Methods to clean chemical mechanical polishing systems (2022-09-20),

Title: Chih-Chieh Chang - Innovative Inventor from Hsinchu

Introduction: Chih-Chieh Chang is a highly skilled inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Chih-Chieh Chang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Chih-Chieh Chang has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Chih-Chieh Chang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Chih-Chieh Chang's passion for innovation, coupled with his technical acumen and collaborative spirit, continues to inspire the next generation of inventors and shape the future of technology in Taiwan and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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