The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 2020
Filed:
Nov. 17, 2016
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Chih-Lin Chen, Kaohsiung, TW;
Chung-Hao Tsai, Changhua County, TW;
Jeng-Shien Hsieh, Kaohsiung, TW;
Chuei-Tang Wang, Taichung, TW;
Chen-Hua Yu, Hsinchu, TW;
Chih-Yuan Chang, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01F 27/245 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76877 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/50 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01F 17/0006 (2013.01); H01F 2017/0066 (2013.01); H01F 2017/0086 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05024 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A package structure includes a first redistribution layer, a molding material, a semiconductor device and an inductor. The molding material is located on the first redistribution layer. The semiconductor device is molded in the molding material. The inductor penetrates through the molding material and electrically connected to the semiconductor device.