Cheng-Yi Peng

This inventor holds 104 USPTO granted patents and 17 published patent applications, primarily in Semiconductor Devices (CPC class H01L29-66795). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2025.

USPTO Granted Patents = 104 (Patent Applications = 17)

% Patents Active = 91.3

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 928(Granted Patents)

Forward Citations (Not Self Cited) = 838(Dec 10, 2025)

Inventors with similar research interests:

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Location History:

Hsin-Chu, TW (2016 - 2017)
Taipei, TW (2015 - 2024)

Company Filing History:

104 out of 42,759

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2015-2025

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Areas of Expertise:

Semiconductor Device

FinFET Fabrication

Core-Shell Nanostructures

Integrated Circuit

Source/Drain Contacts

Passivation Layers

Strained Nanowire CMOS

Manufacturing Method

Spacer Structures

Solid Phase Diffusion

2D Material Layer

Negative Capacitance FET

104 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12477810 - Semiconductor device and manufacturing method thereof (2025-11-18),

2. 12432986 - Spacer structures for semiconductor devices (2025-09-30),

3. 12426322 - Core-shell nanostructures for semiconductor devices (2025-09-23),

4. 12349382 - Semiconductor device and manufacturing method thereof (2025-07-01),

5. 12218203 - Integrated circuit structure and method with solid phase diffusion (2025-02-04),

6. 12142663 - Method for forming source/drain contacts (2024-11-12),

7. 12068392 - FinFET fabrication methods (2024-08-20),

8. 12068371 - Method for FinFET LDD doping (2024-08-20),

9. 12040381 - Method of manufacturing semiconductor devices and semiconductor devices (2024-07-16),

10. 11990510 - Semiconductor device and manufacturing method thereof (2024-05-21),

11. 11942380 - Semiconductor structure and testing method thereof (2024-03-26),

12. 11942376 - Method for manufacturing semiconductor structure (2024-03-26),

13. 11935890 - Method for forming integrated semiconductor device with 2D material layer (2024-03-19),

14. 11929422 - Passivation layers for semiconductor devices (2024-03-12),

15. 11881530 - Spacer structures for semiconductor devices (2024-01-23),

Title: The Innovative Journey of Inventor Cheng-Yi Peng

Introduction: Cheng-Yi Peng, a talented inventor hailing from Taipei, Taiwan, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents: Cheng-Yi Peng holds several patents in various technological domains, showcasing his versatility and creativity in inventing new solutions to complex problems.

Career Highlights: Throughout his illustrious career, Cheng-Yi Peng has been recognized for his exceptional problem-solving skills and forward-thinking approach to innovation. His inventions have not only revolutionized industries but have also improved the lives of many.

Collaborations: Cheng-Yi Peng has collaborated with leading tech companies, research institutions, and universities to further develop his inventions and bring them to the market. His ability to work in diverse teams has led to the successful implementation of his groundbreaking ideas.

Conclusion: In conclusion, Cheng-Yi Peng stands as a beacon of innovation in the technological landscape, with his inventive spirit and dedication to creating impactful solutions. His journey as an inventor continues to inspire future generations to push the boundaries of what is possible through innovation and creativity.