The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 21, 2024

Filed:

Jul. 26, 2021
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Cheng-Yi Peng, Taipei, TW;

Ting Tsai, Hsinchu, TW;

Chung-Wei Hung, Tainan, TW;

Jung-Ting Chen, Zhubei, TW;

Ying-Hua Lai, Taipei, TW;

Song-Bor Lee, Zhubei, TW;

Bor-Zen Tien, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 21/02 (2006.01); H01L 21/265 (2006.01); H01L 29/24 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0847 (2013.01); H01L 29/24 (2013.01); H01L 21/02521 (2013.01); H01L 21/02529 (2013.01); H01L 21/0262 (2013.01); H01L 21/26513 (2013.01); H01L 29/7848 (2013.01); H01L 29/785 (2013.01);
Abstract

A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.


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