IDiyas

For the Inventor, By the Inventor

Hsinchu, Taiwan

Che-Jung Chu

USPTO Granted Patents = 15 

Average Co-Inventor Count = 5.4

ph-index = 4

Forward Citations = 34(Granted Patents)


Company Filing History:

goldMedal15 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2024

Loading Chart...
15 patents (USPTO):
1. 12183709 - Chip package structure with ring-like structure (2024-12-31),
2. 11848302 - Chip package structure with ring-like structure (2023-12-19),
3. 11545463 - Chip package structure with ring-like structure (2023-01-03),
4. 11211318 - Bump layout for coplanarity improvement (2021-12-28),
5. 11088108 - Chip package structure including ring-like structure and method for forming the same (2021-08-10),
6. 10170429 - Method for forming package structure including intermetallic compound (2019-01-01),
7. 10014218 - Method for forming semiconductor device structure with bumps (2018-07-03),
8. 9997601 - Metal-oxide-semiconductor field-effect transistor with extended gate dielectric layer (2018-06-12),
9. 9880192 - Method of manufacturing a motion sensor device (2018-01-30),
10. 9865609 - One-time-programming (OTP) memory cell with floating gate shielding (2018-01-09),
11. 9561954 - Method of fabricating MEMS devices having a plurality of cavities (2017-02-07),
12. 9209298 - Metal-oxide-semiconductor field-effect transistor with extended gate dielectric layer (2015-12-08),
13. 8960003 - Motion sensor device and methods for forming the same (2015-02-24),
14. 8916943 - MEMS devices having a plurality of cavities (2014-12-23),
15. 7091535 - High voltage device embedded non-volatile memory cell and fabrication method (2006-08-15),

Title: Innovations of Inventor Che-Jung Chu

Introduction

Che-Jung Chu is an innovative inventor based in Hsinchu, Taiwan. He has made significant contributions in the field of semiconductor technology, securing 15 patents throughout his career. His inventions focus on improving chip package structures, reflecting his expertise and creativity in the discipline.

Latest Patents

Among Che-Jung Chu's most recent innovations are two notable patents involving chip package structures. The first patent features a chip package structure that includes a chip with a conductive ring-like structure positioned above and electrically insulated from the chip. This ring-like structure surrounds a central region of the chip, enhancing performance. The second patent showcases a similar chip package design but incorporates a conductive bump that is electrically connected to the chip. This version features a ring-like structure that surrounds the bump, both elements made from the same material, providing a robust and efficient solution for semiconductor packaging.

Career Highlights

Che-Jung Chu is presently employed by Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His role at this prestigious company allows him to push the boundaries of technology and innovation in chip packaging. Throughout his career, he has continually demonstrated a commitment to enhancing semiconductor design and efficiency.

Collaborations

Working alongside esteemed colleagues such as Kuo-Chio Liu and Shyh-Wei Cheng, Che-Jung Chu has fostered a collaborative environment that encourages creativity and technological advancement. Their partnership underscores the importance of teamwork in the process of invention and innovation in the fast-paced tech industry.

Conclusion

Che-Jung Chu's contributions to chip packaging technology exemplify the innovative spirit that drives the semiconductor industry forward. With his 15 patents and ongoing work in collaboration with talented peers, he continues to be a pivotal figure in shaping the future of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…