Luchou, Taiwan

Chao-Yang Yeh

This inventor holds 22 USPTO granted patents, primarily in Semiconductor Devices. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chao-Yang Yeh. Retrieved from https://idiyas.com/inventor/chao-yang-yeh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 86.4

Average Co-Inventor Count = 3.2

ph-index = 6

Forward Citations = 78(Granted Patents)


Company Filing History:


Years Active: 2012-2023

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Areas of Expertise:
Test Probing Structure
Semiconductor Device
Interposer
3D Integrated Circuit
Capacitance Analysis
Stacked Die
Noise Reduction
Manufacturing Method
Resonance Convergence
Electronic Article
Validation Techniques
Thermal Management
22 patents (USPTO):Explore Patents

As a specialist in innovations, inventions, inventors, and patents, I'm delighted to share an article about the esteemed inventor Chao-Yang Yeh and his impactful contributions in the field of technology and sustainability. Let's delve into the journey of this visionary inventor from Luzhou, TW.

Title: Championing Innovation and Sustainability: The Inspiring Journey of Chao-Yang Yeh

Introduction:

Chao-Yang Yeh, a distinguished inventor from Luzhou, TW, is a beacon of inspiration for aspiring inventors worldwide. With a remarkable portfolio of 22 patents to his name, Yeh's inventive spirit and dedication to sustainability have paved the way for a brighter future through technology.

Latest Patents:

Among his latest patents, Chao-Yang Yeh has developed a groundbreaking "Test Probing Structure" designed for wafer level testing semiconductor IC packaged devices under test (DUT). This innovative structure features a sophisticated probing unit that enables precise testing without direct probing of the DUT microbumps. Additionally, his invention of the "Semiconductor Device" provides a high-density interconnect pathway for semiconductor devices, revolutionizing the field of integrated fan out packages.

Career Highlights:

With a stellar career at companies like Taiwan Semiconductor Manufacturing Company Limited (TSMC), Chao-Yang Yeh has left an indelible mark on the semiconductor industry. His expertise in developing cutting-edge technologies has significantly impacted the advancement of semiconductor packaging solutions, setting new standards for innovation and efficiency.

Collaborations:

Throughout his career, Chao-Yang Yeh has had the privilege of collaborating with industry pioneers such as Sandeep Kumar Goel and Ming-Tsun Lin. Together, they have spearheaded groundbreaking projects that have redefined the boundaries of technological innovation and sustainability in the semiconductor sector.

Conclusion:

In conclusion, Chao-Yang Yeh's unwavering commitment to innovation and sustainability serves as a testament to the profound impact that creative thinking and ingenuity can have on shaping a better future for all. His remarkable inventions and collaborative efforts continue to inspire the next generation of inventors to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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