The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2017
Filed:
May. 27, 2011
Sandeep Kumar Goel, San Jose, CA (US);
Mill-jer Wang, Hsinchu, TW;
Chung-sheng Yuan, Hsinchu, TW;
Tom Chen, Hsinchu, TW;
Chao-yang Yeh, Luzhou, TW;
Chin-chou Liu, Jhubei, TW;
Yun-han Lee, Baoshan Township, TW;
Sandeep Kumar Goel, San Jose, CA (US);
Mill-Jer Wang, Hsinchu, TW;
Chung-Sheng Yuan, Hsinchu, TW;
Tom Chen, Hsinchu, TW;
Chao-Yang Yeh, Luzhou, TW;
Chin-Chou Liu, Jhubei, TW;
Yun-Han Lee, Baoshan Township, TW;
Abstract
An interposer of a package system includes a first probe pad disposed adjacent to a first surface of the interposer. A second probe pad is disposed adjacent to the first surface of the interposer. A first bump of a first dimension is disposed adjacent to the first surface of the interposer. The first bump is electrically coupled with the first probe pad. A second bump of the first dimension is disposed adjacent to the first surface of the interposer. The second bump is electrically coupled with the second probe pad. The second bump is electrically coupled with the first bump through a redistribution layer (RDL) of the interposer.