The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2017
Filed:
Dec. 31, 2013
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Inventor:
Chao-Yang Yeh, Luzhou, TW;
Assignee:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 9/455 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5045 (2013.01); G06F 17/5063 (2013.01);
Abstract
Some methods provide an electronic design file, which includes an integrated circuit (IC) component that is operably coupled to a package component. The IC component and package component collectively form a resistor inductor capacitor (RLC) resonant circuit. The method also provides a damping component in the electronic design file. This damping component is configured to reduce a pre-resonant time during which energy exchanged in the RLC resonant circuit approaches a steady-state, and thereby speeds simulation time.