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For the Inventor, By the Inventor

Spicewood, TX, United States of America

Bryan Black

This inventor holds 24 USPTO granted patents and 15 published patent applications and 5 EPO patents, primarily in Semiconductor Packaging. Top assignees: Advanced Micro Devices Corporation, Ati Technologies Ulc, Advanced Micro Device, Inc.. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bryan Black. Retrieved from https://idiyas.com/inventor/bryan-black

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 24 

% Patents Active = 100.0

 

Average Co-Inventor Count = 3.8

ph-index = 9

Forward Citations = 152(Granted Patents)


Company Filing History:

goldMedal22 out of 13,168 
 
Advanced Micro Devices Corporation
 patents
silverMedal15 out of 1,119 
 
Ati Technologies Ulc
 patents
bronzeMedal1 out of 24 
 
Advanced Micro Device, Inc.
 patents
4. 1 out of 4 
 
Chipletz, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2011-2026

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Areas of Expertise:
Thru-Silicon Vias
Thermal Management
Semiconductor Chips
Interposer Technology
Data Bus Inversion
Backside Metallization
Polymeric Filler Trench
Thermal Interface Material
Die Stacking
Redundant Connections
Electrical Interconnects
Selective Metallization
24 patents (USPTO):Explore Patents
1. 12568832 - Through package vertical interconnect and method of making same (2026-03-03),
2. 12094853 - Semiconductor chip with redundant thru-silicon-vias (2024-09-17),
3. 11469212 - Semiconductor chip with redundant thru-silicon-vias (2022-10-11),
4. 10290606 - Interposer with identification system (2019-05-14),
5. 9806014 - Interposer with beyond reticle field conductor pads (2017-10-31),
6. 9793239 - Semiconductor workpiece with selective backside metallization (2017-10-17),
7. 9627281 - Semiconductor chip with thermal interface tape (2017-04-18),
8. 9437561 - Semiconductor chip with redundant thru-silicon-vias (2016-09-06),
9. 9385055 - Stacked semiconductor chips with thermal management (2016-07-05),
10. 9263364 - Thermal interface material with support structure (2016-02-16),
11. 8909840 - Data bus inversion coding (2014-12-09),
12. 8866276 - Semiconductor chip device with polymeric filler trench (2014-10-21),
13. 8796842 - Stacked semiconductor chip device with thermal management circuit board (2014-08-05),
14. 8726139 - Unified data masking, data poisoning, and data bus inversion signaling (2014-05-13),
15. 8704353 - Thermal management of stacked semiconductor chips with electrically non-functional interconnects (2014-04-22),

Title: The Innovative Journey of Bryan Black

Introduction: Bryan Black, a talented inventor hailing from Spicewood, Texas, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Bryan Black's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a patented method for enhancing solar panel efficiency through innovative design.

Career Highlights: With a career spanning over two decades, Bryan Black has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with numerous awards and accolades in the tech industry.

Collaborations: Throughout his career, Bryan Black has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking technologies.

Conclusion: Bryan Black's passion for innovation and his relentless drive to push the boundaries of what is possible have cemented his reputation as a pioneering inventor in the field of technology. His contributions continue to inspire the next generation of inventors to think outside the box and create a better future for all.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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