The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Dec. 18, 2013
Applicants:
Michael Z. Su, Round Rock, TX (US);
Gamal Refai-ahmed, Markham, CA;
Bryan Black, Spicewood, TX (US);
Inventors:
Michael Z. Su, Round Rock, TX (US);
Gamal Refai-Ahmed, Markham, CA;
Bryan Black, Spicewood, TX (US);
Assignees:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
ATI Technologies ULC, Markham, CA;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/56 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/24 (2013.01); H01L 2224/73203 (2013.01); H01L 2924/12044 (2013.01); H01L 2224/13099 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06568 (2013.01); H01L 21/563 (2013.01); H01L 2924/014 (2013.01); H01L 23/49833 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01047 (2013.01); H01L 2225/06513 (2013.01); H01L 25/0657 (2013.01); H01L 23/3675 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/83051 (2013.01); H01L 23/3121 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/01046 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/01032 (2013.01); H01L 23/147 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/167 (2013.01); H01L 23/49822 (2013.01); H01L 23/293 (2013.01); H01L 23/295 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/0103 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/166 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/16251 (2013.01); H01L 23/49575 (2013.01); H01L 2225/06565 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/01078 (2013.01); H01L 23/3128 (2013.01); H01L 2924/01033 (2013.01); H01L 2225/06517 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/16152 (2013.01);
Abstract
A method of manufacturing is provided that includes providing a semiconductor chip with an insulating layer. The insulating layer includes a trench. A second semiconductor chip is stacked on the first semiconductor chip to leave a gap. A polymeric filler is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.