The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2014

Filed:

Aug. 20, 2010
Applicants:

Gamal Refai-ahmed, Markham, CA;

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Inventors:

Gamal Refai-Ahmed, Markham, CA;

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Assignees:

ATI Technologies ULC, Markham, CA;

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of assembling a semiconductor chip device is provided that includes providing a circuit board including a surface with an aperture. A portion of a first heat spreader is positioned in the aperture. A stack is positioned on the first heat spreader. The stack includes a first semiconductor chip positioned on the first heat spreader and a substrate that has a first side coupled to the first semiconductor chip.


Find Patent Forward Citations

Refai-Ahmed, Gamal. (2014). Stacked semiconductor chip device with thermal management circuit board (U.S. Patent No. 8796842). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8796842

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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