The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 05, 2016

Filed:

Aug. 20, 2010
Applicants:

Gamal Refai-ahmed, Markham, CA;

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Maxat Touzelbaev, San Jose, CA (US);

Yizhang Yang, Sunnyvale, CA (US);

Inventors:

Gamal Refai-Ahmed, Markham, CA;

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Maxat Touzelbaev, San Jose, CA (US);

Yizhang Yang, Sunnyvale, CA (US);

Assignees:

ATI Technologies ULC, Markham, CA;

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/04 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 23/10 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/04 (2013.01); H01L 23/367 (2013.01); H01L 23/42 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); H01L 21/563 (2013.01); H01L 23/10 (2013.01); H01L 23/49827 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A method of assembling a semiconductor chip device is provided that includes placing an interposer on a first semiconductor chip. The interposer includes a first surface seated on the first semiconductor chip and a second surface adapted to thermally contact a heat spreader. The second surface includes a first aperture. A second semiconductor chip is placed in the first aperture.


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