The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 14, 2019

Filed:

Jun. 21, 2012
Applicants:

Michael Alfano, Austin, TX (US);

Joe Siegel, Brookline, MA (US);

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Julius Din, Reedley, CA (US);

Inventors:

Michael Alfano, Austin, TX (US);

Joe Siegel, Brookline, MA (US);

Michael Z. Su, Round Rock, TX (US);

Bryan Black, Spicewood, TX (US);

Julius Din, Reedley, CA (US);

Assignee:

Advanced Micro Devices, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 25/065 (2006.01); H01L 23/14 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); H01L 23/49827 (2013.01); H01L 23/5382 (2013.01); H01L 23/544 (2013.01); H01L 22/14 (2013.01); H01L 22/20 (2013.01); H01L 23/147 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 2223/5444 (2013.01); H01L 2223/54446 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54473 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13164 (2013.01); H01L 2224/13169 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Various interposers and method of manufacturing related thereto are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an identification structure to an interposer. The identification structure is operable to provide identification information about the interposer. The identification structure is programmable to create or alter the identification information.


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