The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
Aug. 20, 2010
Seth Prejean, Austin, TX (US);
Dales Kent, Round Rock, TX (US);
Ronnie Brandon, Austin, TX (US);
Gamal Refai-ahmed, Markam, CA;
Michael Z. Su, Round Rock, TX (US);
Michael Bienek, Austin, TX (US);
Joseph Siegel, Brookline, MA (US);
Bryan Black, Spicewood, TX (US);
Seth Prejean, Austin, TX (US);
Dales Kent, Round Rock, TX (US);
Ronnie Brandon, Austin, TX (US);
Gamal Refai-Ahmed, Markam, CA;
Michael Z. Su, Round Rock, TX (US);
Michael Bienek, Austin, TX (US);
Joseph Siegel, Brookline, MA (US);
Bryan Black, Spicewood, TX (US);
Advanced Micro Device, Inc., Sunnyvale, CA (US);
ATI Technologies ULC, Markham, CA;
Abstract
A method of manufacturing is provided that includes applying a thermal interface tape to a side of a semiconductor wafer that includes at least one semiconductor chip. The thermal interface material tape is positioned on the at least one semiconductor chip. The at least one semiconductor chip is singulated from the semiconductor wafer with at least a portion of the thermal interface tape still attached to the semiconductor chip.