The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2017
Filed:
Sep. 25, 2015
Applicants:
Michael Z. Su, Austin, TX (US);
Michael S. Alfano, Austin, TX (US);
Bryan Black, Spicewood, TX (US);
Inventors:
Michael Z. Su, Austin, TX (US);
Michael S. Alfano, Austin, TX (US);
Bryan Black, Spicewood, TX (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01); H01L 23/367 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0652 (2013.01); H01L 21/768 (2013.01); H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 23/3675 (2013.01); H01L 23/49838 (2013.01); H01L 23/528 (2013.01); H01L 25/50 (2013.01); H01L 2225/06589 (2013.01);
Abstract
Various semiconductor workpieces with selective backside metallizations and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor workpiece that has multiple dies. A backside metallization is fabricated on a first die of the dies but not on a second die of the dies.