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Austin, TX, United States of America

Bradley Paul Smith

This inventor holds 18 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Technology. Top assignees: Freescale Semiconductor,inc., Motorola Corporation, Nxp USA, Inc.. Active years: 1994-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bradley Paul Smith. Retrieved from https://idiyas.com/inventor/bradley-paul-smith

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 18

% Patents Active = 66.7


Average Co-Inventor Count = 1.7

ph-index = 6

Forward Citations = 184(Granted Patents)


Company Filing History:

goldMedal10 out of 5,491 
 
Freescale Semiconductor,inc.
 patents
silverMedal7 out of 20,290 
 
Motorola Corporation
 patents
bronzeMedal1 out of 2,856 
 
Nxp USA, Inc.
 patents

Years Active: 1994-2018

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Areas of Expertise:
Silicon-On-Insulator
Transistor Aging
Non-Volatile Memory
MOSFET
Capacitor
Through-Via
Current Leakage
Photovoltaic Current
Feature Sizing
Barrier Layer
Dual Copper Interconnect
Field Isolation
18 patents (USPTO):Explore Patents
1. 10062713 - Devices and methods for fully depleted silicon-on-insulator back biasing (2018-08-28),
2. 9064785 - Electronic device including a capacitor and a process of forming the same (2015-06-23),
3. 9000507 - Method and system for recovering from transistor aging using heating (2015-04-07),
4. 8426263 - Patterning a gate stack of a non-volatile memory (NVM) with formation of a metal-oxide-semiconductor field effect transistor (MOSFET) (2013-04-23),
5. 8420480 - Patterning a gate stack of a non-volatile memory (NVM) with formation of a gate edge diode (2013-04-16),
6. 8415217 - Patterning a gate stack of a non-volatile memory (NVM) with formation of a capacitor (2013-04-09),
7. 7985655 - Through-via and method of forming (2011-07-26),
8. 7923369 - Through-via and method of forming (2011-04-12),
9. 7589550 - Semiconductor device test system having reduced current leakage (2009-09-15),
10. 7238579 - Semiconductor device for reducing photovolatic current (2007-07-03),
11. 6956281 - Semiconductor device for reducing photovolatic current (2005-10-18),
12. 6489083 - Selective sizing of features to compensate for resist thickness variations in semiconductor devices (2002-12-03),
13. 6459156 - Semiconductor device, a process for a semiconductor device, and a process for making a masking database (2002-10-01),
14. 6451181 - Method of forming a semiconductor device barrier layer (2002-09-17),
15. 6326301 - Method for forming a dual inlaid copper interconnect structure (2001-12-04),

Title: The Innovative Contributions of Bradley Paul Smith

Introduction

Bradley Paul Smith is a prominent inventor based in Austin, TX, known for his significant contributions to the field of integrated circuits and electronic devices. With a total of 18 patents to his name, Smith has made remarkable advancements that have influenced modern technology.

Latest Patents

Among his latest patents, one notable invention is related to devices and methods for fully depleted silicon-on-insulator back biasing. This integrated circuit design features a first device with a first threshold voltage adjusting implant extension region, which is crucial for enhancing the performance of electronic components. Another significant patent involves an electronic device that includes a capacitor and a process for forming it. This invention outlines a method for creating a capacitor with a defect detection mechanism, ensuring higher reliability in electronic devices.

Career Highlights

Throughout his career, Bradley Paul Smith has worked with leading companies in the technology sector, including Freescale Semiconductor and Motorola Corporation. His experience in these organizations has allowed him to develop innovative solutions that address complex challenges in electronics.

Collaborations

Smith has collaborated with several talented individuals in his field, including Edward Outlaw Travis, Jr. and Sejal N Chheda. These partnerships have contributed to the successful development of his patents and innovations.

Conclusion

Bradley Paul Smith's work exemplifies the spirit of innovation in the technology industry. His patents and contributions continue to shape the future of electronic devices and integrated circuits.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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