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For the Inventor, By the Inventor

Ridgefield, CT, United States of America

Bomy A Chen

LinkedIn
USPTO Granted Patents = 92 

 

Average Co-Inventor Count = 2.7

ph-index = 20

Forward Citations = 1,835(Granted Patents)

Forward Citations (Not Self Cited) = 1,814(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Dutchess County, NY (US) (1996)
  • Hopewell Junction, NY (US) (1996 - 2001)
  • Ridgefield, CT (US) (2002 - 2003)
  • Stormville, NY (US) (2001 - 2004)
  • Cupertino, CA (US) (2004 - 2014)
  • Newark, CA (US) (2016 - 2024)

Company Filing History:

goldMedal49 out of 623 
 
Silicon Storage Technology, Inc.
 patents
silverMedal21 out of 164,197 
 
International Business Machines Corporation
 patents
bronzeMedal20 out of 1,343 
 
Microchip Technology Inc.
 patents
4. 2 out of 832,843 
Other
 patents

Years Active: 1996-2025

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Areas of Expertise:
Integrated Circuit Package
Thermally Conductive Nanoparticles
Vapor Cells
Multi-Material Bond Pad
Flash Memory Cell
High Voltage DMOS Device
Non-Volatile Memory Cell
Phase Change Memory Device
Bi-Directional Read Non-Volatile Memory
Memory Array
Wafer Bonding
Semiconductor Composites
92 patents (USPTO):Explore Patents
1. 12424502 - Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles (2025-09-23),
2. 12395179 - Vapor cells and related systems and methods (2025-08-19),
3. 12205910 - Integrated circuit bond pad with multi-material toothed structure (2025-01-21),
4. 12040282 - Electronic device including interposers bonded to each other (2024-07-16),
5. 11935824 - Integrated circuit package module including a bonding system (2024-03-19),
6. 11764796 - Vapor cells and related systems and methods (2023-09-19),
7. 11723222 - Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate (2023-08-08),
8. 11682642 - Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond (2023-06-20),
9. 11682641 - Integrated circuit bond pad with multi-material toothed structure (2023-06-20),
10. 11043471 - Mixed-orientation multi-die integrated circuit package with at least one vertically-mounted die (2021-06-22),
11. 10896888 - Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond (2021-01-19),
12. 10861550 - Flash memory cell adapted for low voltage and/or non-volatile performance (2020-12-08),
13. 10700171 - Non-volatile flash memory cell (2020-06-30),
14. 10546947 - Memory cell with oxide cap and spacer layer for protecting a floating gate from a source implant (2020-01-28),
15. 10381330 - Sacrificial alignment ring and self-soldering vias for wafer bonding (2019-08-13),

Title: The Innovative Journey of Bomy A Chen

Introduction: Bomy A Chen, a pioneering inventor based in Ridgefield, CT (US), has made significant contributions to the world of innovations with her groundbreaking ideas and inventions.

Latest Patents: Bomy A Chen holds several patents in various fields, including technology, healthcare, and sustainability. Her most recent patents focus on renewable energy solutions and advanced medical devices.

Career Highlights: With a career spanning over two decades, Bomy A Chen has established herself as a leading figure in the innovation industry. She has worked with top research institutions and companies to bring her ideas to life.

Collaborations: Throughout her career, Bomy A Chen has collaborated with renowned scientists, engineers, and designers to create cutting-edge products that have revolutionized their respective industries. Her collaborative spirit has led to the development of innovative solutions that have had a lasting impact.

Conclusion: Bomy A Chen's passion for innovation and her relentless pursuit of excellence have cemented her legacy as a trailblazer in the world of inventions. Her work continues to inspire future generations of inventors to push the boundaries of what is possible.

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