The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 2026
Filed:
Jul. 13, 2023
Applicant:
Microchip Technology Incorporated, Chandler, AZ (US);
Inventors:
Matthew Martin, Gilbert, AZ (US);
Bomy Chen, Newark, CA (US);
Julius Kovats, Manitou Springs, CO (US);
Assignee:
Microchip Technology Incorporated, Chandler, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 44/00 (2026.01); H10P 95/00 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 44/501 (2026.01); H10P 95/00 (2026.01); H10W 70/65 (2026.01); H10W 70/685 (2026.01); H10W 74/111 (2026.01); H10W 90/00 (2026.01); H10W 90/794 (2026.01);
Abstract
An integrated circuit (IC) package includes a bare die mounted on a substrate, and a conductive routing region including conductive routing structure and an inductor. The conductive routing structure is conductively connected to the bare die, and includes conductive elements formed in multiple conductive routing layers in the conductive routing region. The inductive device includes a winding formed in at least one conductive routing layer of the multiple conductive routing layers.