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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12424502 B1

PDFFull Text
Date of Patent:
Sep. 23, 2025

Filed:

Aug. 17, 2022

Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles

Applicant:

Microchip Technology Incorporated, Chandler, AZ (US);

Inventors:

Bomy Chen, Newark, CA (US);

Justin Sato, West Linn, OR (US);

Assignee:

Microchip Technology Incorporated, Chandler, AZ (US);

Attorney:

SLAYDEN GRUBERT BEARD PLLC

Primary Examiner:

Yu-Hsi D Sun

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/552 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3135 (2013.01); H01L 21/56 (2013.01); H01L 23/295 (2013.01); H01L 23/552 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 23/3121 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48105 (2013.01); H01L 2224/48175 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06589 (2013.01);
Abstract

An electronic device includes an integrated circuit package including a die mounted on a die carrier, a mold structure at least partially encapsulating the mounted die, and a heat transfer chimney formed on the die. The heat transfer chimney extends at least partially through the mold structure to transfer heat away from the die. The heat transfer chimney is formed from a thermally conductive compound including thermally conductive nanoparticles.

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Chen, Bomy. (2025). Integrated circuit package with heat transfer chimney including thermally conductive nanoparticles (U.S. Patent No. 12424502). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12424502

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