Barbara Vasquez

This inventor holds 25 USPTO granted patents, primarily in Semiconductor Fabrication. Top assignees: Infineon Technologies Ag, Formfactor, Inc.. Active years: 2003-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Barbara Vasquez. Retrieved from https://idiyas.com/inventor/barbara-vasquez

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 25

% Patents Active = 52.0

Average Co-Inventor Count = 2.9

ph-index = 11

Forward Citations = 504(Granted Patents)

Location History:

München, DE (2003 - 2004)
Munich, DE (2003 - 2005)
Livermore, CA (US) (2005)
Orinda, CA (US) (2004 - 2007)
Lafayette, CA (US) (2007 - 2012)

Company Filing History:

22 out of 15,023

Infineon Technologies Ag

Years Active: 2003-2012

Loading Chart...

Areas of Expertise:

Stacked Die Module

IC Probing

Memory Chip

Semiconductor Circuit

Wafer Level Packaging

Integrated Circuit

Compliant Buffer Layer

Electronic Component

Chip Testing

Thin Semiconductor Device

Contact Connection

Circuit Units

25 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8324725 - Stacked die module (2012-12-04),

2. 7659736 - Mechanically reconfigurable vertical tester interface for IC probing (2010-02-09),

3. 7338843 - Method for producing an electronic component, especially a memory chip (2008-03-04),

4. 7230437 - Mechanically reconfigurable vertical tester interface for IC probing (2007-06-12),

5. 7211451 - Process for producing a component module (2007-05-01),

6. 7176131 - Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same (2007-02-13),

7. 7087512 - Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions (2006-08-08),

8. 7074696 - Semiconductor circuit module and method for fabricating semiconductor circuit modules (2006-07-11),

9. 6953708 - Method of producing a semiconductor component having a compliant buffer layer (2005-10-11),

10. 6919232 - Process for producing a semiconductor chip (2005-07-19),

11. 6916185 - Connection of integrated circuit to a substrate (2005-07-12),

12. 6905954 - Method for producing a semiconductor device and corresponding semiconductor device (2005-06-14),

13. 6888256 - Compliant relief wafer level packaging (2005-05-03),

14. 6861291 - Method producing a contact connection between a semiconductor chip and a substrate and the contact connection (2005-03-01),

15. 6845554 - Method for connection of circuit units (2005-01-25),

Title: The Innovative Journey of Barbara Vasquez

Introduction

Barbara Vasquez, a prolific inventor based in Orinda, CA, holds an impressive portfolio with 25 patents to her name. Her contributions to the field of semiconductor technology demonstrate her commitment to advancing innovation and addressing the challenges faced in the industry.

Latest Patents

Among her latest inventions is the "Stacked Die Module," designed for semiconductor dies. This innovation involves stacking the dies offset from one another, allowing for terminals along two edges of each die to be exposed. This configuration enables efficient electrical connections between the dies while ensuring they are connected to a wiring substrate.

Another significant patent is the "Mechanically Reconfigurable Vertical Tester Interface for IC Probing." This wafer test assembly features multiple probe head substrates arranged like tiles, allowing for efficient testing of integrated circuits. The design includes flexible cable connectors and a test head connector interface frame that simplifies the connection between the probe card and the test head. This innovative approach facilitates both full and partial wafer contact, enhancing the efficiency of IC probing.

Career Highlights

Throughout her career, Barbara has made substantial contributions while working with prominent companies such as Infineon Technologies AG and FormFactor, Inc. Her work experience has equipped her with the knowledge and expertise to push the boundaries of semiconductor testing and innovation.

Collaborations

Barbara's journey in innovation has often intersected with talented professionals in the field. Notable collaborators include Harry Hedler and Thorsten Meyer, both of whom have worked alongside Barbara to bring groundbreaking ideas to fruition.

Conclusion

With a remarkable track record of 25 patents and groundbreaking technological advancements, Barbara Vasquez continues to be a notable figure in the semiconductor industry. Her dedication to innovation and collaboration paves the way for future developments in integrated circuit testing and semiconductor technologies.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]