The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2006
Filed:
Jul. 29, 2003
Gerd Frankowsky, Höhenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Gerd Frankowsky, Höhenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Infineon Technologies AG, Munich, DE;
Abstract
The present invention provides a method for fabricating semiconductor circuit modules having the following steps: application of a patterned connection layer to a transfer substrate, application of active circuit devices and/or passive circuit devices with contact areas pointing toward the patterned connection layer, connection of the circuit devices to one another by means of a filler at least between the circuit devices, removal of the transfer substrate, and application of electrical connection devices for selective contact connection of the contact area of the circuit devices to one another.