The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2005
Filed:
Nov. 18, 2002
Gerd Frankowsky, Hohenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Roland Irsigler, Munich, DE;
Thorsten Meyer, Dresden, DE;
Barbara Vasquez, Livermore, CA (US);
Gerd Frankowsky, Hohenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Roland Irsigler, Munich, DE;
Thorsten Meyer, Dresden, DE;
Barbara Vasquez, Livermore, CA (US);
Infineon Technologies AG, München, DE;
Abstract
The invention creates a method for connection of circuit units () which are arranged on a wafer (), in which the wafer () is fitted to a first film (), the wafer () is sawn such that the circuit units () which are arranged on the wafer () are separated, the functional circuit units () are picked up by means of a handling device () and are placed down on a second film () by means of the handling device (), so as to produce a separation distance which can be predetermined between connection contacts of the circuit units ().