The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2005
Filed:
Aug. 05, 2003
Applicants:
Harry Hedler, Germering, DE;
Thorsten Meyer, Dresden, DE;
Barbara Vasquez, Orinda, CA (US);
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L021/44 ;
U.S. Cl.
CPC ...
Abstract
The present invention provides a method for producing a semiconductor device, with the steps of: applying an interconnect level () to a semiconductor substrate (); structuring the interconnect level (); and applying a solder layer () on the structured interconnect level () in such a way that the solder layer () assumes the structure of the interconnect level (). The present invention likewise provides such a semiconductor device.