The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 12, 2005
Filed:
Jun. 18, 2003
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Infineon Technologies AG, Munich, DE;
Abstract
The present invention provides a method of connecting an integrated circuit to a substrate and a corresponding circuit arrangement. Connecting occurs by performing the steps of: providing a main area (HF) of the integrated circuit (), which has an electrical contacting region (), with a mechanical supporting structure (); providing a solderable surface region () of the mechanical supporting structure (); providing a solderable terminal region (), which is electrically connected to the electrical contacting region (), on the main area (HF) of the integrated circuit (); providing a main area (HF) of the substrate () with a first soldering region (), which can be aligned with the solderable surface regions (), and with a second soldering region (), which can be aligned with the solderable terminal region (); and simultaneous soldering of the surface regions () to the first soldering region () and of the terminal region () to the second soldering region ().