The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 01, 2007
Filed:
Nov. 18, 2002
Applicants:
Thorsten Meyer, Dresden, DE;
Gerd Frankowsky, Hohenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Roland Irsigler, Munich, DE;
Inventors:
Thorsten Meyer, Dresden, DE;
Gerd Frankowsky, Hohenkirchen-Siegertsbrunn, DE;
Harry Hedler, Germering, DE;
Barbara Vasquez, Orinda, CA (US);
Roland Irsigler, Munich, DE;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/00 (2006.01); H01L 23/28 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract
A process for producing a component module comprising a module carrier and a plurality of components with which contact is made on the latter, comprising the following steps: