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For the Inventor, By the Inventor

Toyama, Japan

Atsuro Seino

USPTO Granted Patents = 19 

Average Co-Inventor Count = 2.5

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Koyama, JP (2022)
  • Toyama, JP (2016 - 2024)

Company Filing History:

goldMedal13 out of 608 
 
Kokusai Electric Corporation
 patents
silverMedal5 out of 1,258 
 
Hitachi-kokusai Electric Inc.
 patents
bronzeMedal1 out of 1 
 
Kokusa Electric Corporation
 patent

Years Active: 2016-2025

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19 patents (USPTO):Explore Patents
1. 12463031 - Method of processing substrate, recording medium, and substrate processing apparatus (2025-11-04),
2. 12451360 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2025-10-21),
3. 12421609 - Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2025-09-23),
4. 12170206 - Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (2024-12-17),
5. 12148621 - Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (2024-11-19),
6. 12084760 - Method of processing substrate, recording medium, substrate processing apparatus, and method of manufacturing semiconductor device (2024-09-10),
7. 12084757 - Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium (2024-09-10),
8. 11967500 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2024-04-23),
9. 11915938 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2024-02-27),
10. 11621169 - Method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (2023-04-04),
11. 11538688 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2022-12-27),
12. 11424127 - Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium (2022-08-23),
13. 10734218 - Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium (2020-08-04),
14. 10410870 - Method of manufacturing semiconductor device (2019-09-10),
15. 9972500 - Method of manufacturing semiconductor device (2018-05-15),

Title: The Innovative Journey of Atsuro Seino

Introduction: Atsuro Seino is a pioneering inventor hailing from Toyama, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Atsuro Seino holds several patents in the realm of robotics and artificial intelligence, with his most recent inventions focusing on advanced machine learning algorithms for autonomous systems.

Career Highlights: With a career spanning over two decades, Atsuro Seino has worked with leading tech companies in Japan, spearheading research and development projects that have pushed the boundaries of technological advancement.

Collaborations: Throughout his career, Atsuro Seino has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Atsuro Seino's relentless pursuit of innovation and his passion for creating cutting-edge technologies have solidified his reputation as a visionary inventor in the global tech community.

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