The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Sep. 15, 2021
Applicant:
Kokusai Electric Corporation, Tokyo, JP;
Inventors:
Arito Ogawa, Toyama, JP;
Atsuro Seino, Toyama, JP;
Assignee:
KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); C23C 16/18 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28568 (2013.01); C23C 16/18 (2013.01); C23C 16/45527 (2013.01); C23C 16/45553 (2013.01); H01L 21/28556 (2013.01);
Abstract
There is included (a) supplying a gas containing an organic ligand to a substrate; (b) supplying a metal-containing gas to the substrate; and (c) supplying a first reducing gas to the substrate, wherein after (a), a metal-containing film is formed on the substrate by performing (b) and (c) one or more times, respectively.
Ogawa, Arito. (2022). Method of manufacturing semiconductor device, substrate processing apparatus, method of processing substrate, and recording medium (U.S. Patent No. 11424127). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11424127
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile