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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12148621 B1

PDFFull Text
Date of Patent:
Nov. 19, 2024

Filed:

Mar. 31, 2023

Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus

Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Koei Kuribayashi, Toyama, JP;

Arito Ogawa, Toyama, JP;

Atsuro Seino, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Sonya McCall-Shepard

Int. Cl.
CPC ...
H01L 21/285 (2006.01); C23C 16/14 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/02 (2006.01); H01L 21/3205 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28556 (2013.01); C23C 16/14 (2013.01); C23C 16/45523 (2013.01); H01L 21/28568 (2013.01); H01L 21/32051 (2013.01); H01L 21/67207 (2013.01);
Abstract

There is provided a technique that includes: (a) supplying a molybdenum-containing gas containing molybdenum and oxygen to a substrate in a process chamber; (b) supplying an additive gas containing hydrogen to the substrate; and (c) supplying a reducing gas containing hydrogen and having a chemical composition different from that of the additive gas to the substrate, wherein at least two of (a), (b), and (c) are performed simultaneously or to partially overlap with each other in time one or more times or (a), (b), and (c) are performed sequentially one or more times to form a molybdenum film on the substrate.

Find Patent Forward Citations

Kuribayashi, Koei. (2024). Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus (U.S. Patent No. 12148621). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12148621

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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