Arkadii V Samoilov

This inventor holds 73 USPTO granted patents and 6 published patent applications and 2 EPO patents, primarily in Wafer-Level Packaging (CPC class H01L). Top assignees: Maxim Integrated Products, Inc., Applied Materials, Inc., Qualcomm Incorporated. Active years: 2002-2019.

USPTO Granted Patents = 73 (Patent Applications = 6)

% Patents Active = 80.8

EPO Patents = 2 (Patent Applications = 4)

Average Co-Inventor Count = 3.3

ph-index = 15

Forward Citations = 1,173(Granted Patents)

Forward Citations (Not Self Cited) = 1,115(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Sartoga, CA (US) (2011)
Sunnyvale, CA (US) (2002 - 2013)
Saratoga, CA (US) (2010 - 2019)

Company Filing History:

43 out of 1,298

Maxim Integrated Products, Inc.

patents

26 out of 14,391

Applied Materials, Inc.

patents

1 out of 44,618

Qualcomm Incorporated

patents

4. 1 out of 163

Qualcomm Technologies, Inc.

patents

5. 2 out of 834,307

Other

patents

Years Active: 2002-2019

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Areas of Expertise:

Wafer-Level Package

Optical Sensor

Thermo-Electric IR Detectors

High-Resolution Sensor

Gas Concentration Sensor

Through-Substrate Via

Solder Bump Assemblies

Multi-Die Package

Cloaking Layers

Fan-Out Packaging

Integrated Circuit

Reliability Enhancements

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10475937 - Optical sensor packages employing cloaking layers (2019-11-12),

2. 10439118 - MEMS-based wafer level packaging for thermo-electric IR detectors (2019-10-08),

3. 10268864 - High-resolution electric field sensor in cover glass (2019-04-23),

4. 10168211 - Fully integrated gas concentration sensor (2019-01-01),

5. 10132679 - Ultraviolet sensor having filter (2018-11-20),

6. 9966350 - Wafer-level package device (2018-05-08),

7. 9851250 - Fully integrated gas concentration sensor (2017-12-26),

8. 9837368 - Enhanced board level reliability for wafer level packages (2017-12-05),

9. 9806047 - Wafer level device and method with cantilever pillar structure (2017-10-31),

10. 9704809 - Fan-out and heterogeneous packaging of electronic components (2017-07-11),

11. 9659900 - Semiconductor device having a die and through-substrate via (2017-05-23),

12. 9583425 - Solder fatigue arrest for wafer level package (2017-02-28),

13. 9558390 - High-resolution electric field sensor in cover glass (2017-01-31),

14. 9472696 - Light sensor having a contiguous IR suppression filter and transparent substrate (2016-10-18),

15. 9472586 - Light sensor having transparent substrate and through-substrate vias and a contiguous IR suppression filter (2016-10-18),

Title: The Innovative Journey of Arkadii V Samoilov

Introduction:

Arkadii V Samoilov is a pioneering inventor based in Saratoga, CA (US) known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents:

Arkadii V Samoilov holds several patents in various technological domains, showcasing his versatility and ingenuity in creating novel solutions to complex problems.

Career Highlights:

Throughout his illustrious career, Arkadii V Samoilov has consistently pushed the boundaries of innovation, with a focus on developing cutting-edge technologies that have the potential to revolutionize industries.

Collaborations:

Arkadii V Samoilov has collaborated with leading research institutions, universities, and tech companies to further his research and bring his inventions to life. His collaborative spirit has led to the development of impactful technologies with real-world applications.

Conclusion:

In conclusion, Arkadii V Samoilov's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a visionary inventor in the tech industry. His contributions continue to inspire future generations of inventors and innovators.