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For the Inventor, By the Inventor

San Diego, CA, United States of America

Qualcomm Technologies, Inc.


USPTO Granted Patents = 159


Forward Citations = 1,093

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190 inventors (with patents filed for the assignee):

goldMedal Jean-Jacques Lecler (14 out of 21 patents)

silverMedal Philippe Boucard (14 out of 29 patents)

bronzeMedal Eugene Izhikevich (12 out of 98 patents)

4.  Robert J Littrell (10 out of 37 patents)

5.  Filip Lukasz Piekniewski (9 out of 46 patents)

6.  Jeffrey Alexander Levin (9 out of 59 patents)

7.  Laurent Rene Moll (8 out of 65 patents)

8.  Edgar Schmidhammer (7 out of 73 patents)

9.  Seung Hyuk Kang (6 out of 247 patents)

10.  Efstratios Gavves (6 out of 16 patents)

11.  Arnold Wilhelmus Maria Smeulders (6 out of 12 patents)

12.  Seong-Ook Jung (6 out of 72 patents)

13.  Noam Levy (6 out of 16 patents)

14.  Botond Szatmary (5 out of 40 patents)

15.  Jayram Moorkanikara Nageswaran (5 out of 14 patents)


Core Competencies:
Biometric Authentication
Federated Learning
Graph Convolutional Neural Network
Acoustic Transducer
MEMS Microphone
Pose Estimation
Video Processing
Object Localization
Machine Learning
Spherical Regression
Transducer Systems
Environmental Compensation

159 patents:

1. 12487912 - Bootstrapping program synthesis language models to perform repairing (2025-12-02),
2. 12405365 - Environment model using cross-sensor feature point referencing (2025-09-02),
3. 12249138 - Context-driven learning of human-object interactions (2025-03-11),
4. 12231302 - Zone-based federated learning (2025-02-18),
5. 12216746 - Biometric authentication using voice accelerometer (2025-02-04),
6. 12211276 - Lingually constrained tracking of visual objects (2025-01-28),
7. 12163913 - Electrochemical gas sensor with varying bias voltage and environmental compensation (2024-12-10),
8. 12158922 - Gauge equivariant geometric graph convolutional neural network (2024-12-03),
9. 12149716 - Contrastive object representation learning from temporal data (2024-11-19),
10. 12142577 - Package comprising metal layer configured for electromagnetic interference shield and heat dissipation (2024-11-12),
11. 12058939 - Piezoelectric MEMS microphone (2024-08-06),
12. 12010488 - Microphone having a digital output determined at different power consumption levels (2024-06-11),
13. 11950052 - Acoustic transducer with gap-controlling geometry and method of manufacturing an acoustic transducer (2024-04-02),
14. 11948853 - High-power die heat sink (2024-04-02),
15. 11930334 - Piezoelectric MEMS device with an adaptive threshold for detection of an acoustic stimulus (2024-03-12),
Qualcomm Technologies, Inc. is a leader in the development and commercialization of foundational technologies for the wireless industry. With a focus on innovation, Qualcomm delivers products and solutions that empower individuals and businesses to connect and communicate seamlessly. Their cutting-edge technologies span the mobile, networking, automotive, and IoT sectors, and are designed to drive the future of connectivity.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 30 2025

159 Patents

#35 in San Diego, CA

#552 in California

#2,418 in US

#5,048 in the World

...
San Diego, CA, United States of America

Qualcomm Technologies, Inc.

Forward Citations = 1,093

190 inventors:

goldMedal Jean-Jacques Lecler (14 out of 21 patents)

silverMedal Philippe Boucard (14 out of 29 patents)

bronzeMedal Eugene Izhikevich (12 out of 98 patents)

4.  Robert J Littrell (10 out of 37 patents)

5.  Filip Lukasz Piekniewski (9 out of 46 patents)

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