The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 2026
Filed:
Sep. 15, 2023
Qualcomm Technologies, Inc., San Diego, CA (US);
Rf360 Singapore Pte. Ltd., Singapore, SG;
Yeng Kwan Hoo, Unterhaching, DE;
Emre Topal, Munich, DE;
Shook Foong Ho, Singapore, SG;
Poh Hoong Yong, Johor Bahru, MY;
Huan En Ku, Singapore, SG;
QUALCOMM TECHNOLOGIES, INC., San Diego, CA (US);
RF360 SINGAPORE PTE. LTD., Singapore, SG;
Abstract
Bare die package with guard to reduce or prevent material seepage into an air cavity, and related fabrication methods. In exemplary aspects, to avoid or reduce material (e.g., an encapsulation material such as a mold material and/or a coating material) from entering or seeping into the air cavity in the active filter region of a filter, the die package includes a guard structure. The guard structure is a structure on or adjacent to the die operable to be used in a filter that redirects or reduces material from entering the gap between the die and the substrate. The guard structure reduces or prevents the material entering the air cavity of the die so as to avoid such material affecting the acoustic performance of the air cavity of the filter.