This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Qualcomm Incorporated, Qualcomm Technologies, Inc., Rf360 Singapore Pte. Ltd.. Active years: 2026.
Company Filing History:
1 out of 44,679 
1 out of 163 
1 out of 95 Years Active: 2026
Title: Emre Topal: Innovator in Integrated Bare Die Packages
Introduction
Emre Topal is a notable inventor based in Munich, Germany. He has made significant contributions to the field of integrated packaging technology. His innovative work focuses on enhancing the functionality and efficiency of electronic components.
Latest Patents
Emre Topal holds a patent for an "Integrated bare die package, and related fabrication methods." This patent discloses methods for integrating a bare die filter into a bare die package while maintaining an acoustic cavity for the filter. The design minimizes the expansion in size of the package, allowing for the vertical integration of the bare die filter with a second component, such as another die or passive electrical devices. This innovation is crucial for conserving package size while ensuring optimal performance.
Career Highlights
Emre Topal is currently employed at Qualcomm Incorporated, a leading company in the telecommunications industry. His work at Qualcomm has allowed him to push the boundaries of integrated packaging technology. With a focus on practical applications, he has contributed to advancements that benefit the electronics sector.
Collaborations
Emre has collaborated with talented coworkers, including Yeng Kwan Hoo and Anna Katharina Krefft. Their combined expertise fosters an environment of innovation and creativity, leading to groundbreaking developments in their field.
Conclusion
Emre Topal's contributions to integrated bare die packages exemplify the spirit of innovation in technology. His patent and work at Qualcomm highlight the importance of efficient design in electronic components. Emre continues to be a driving force in the advancement of integrated packaging solutions.