The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 2026

Filed:

Dec. 15, 2022
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Yeng Kwan Hoo, Unterhaching, DE;

Anna Katharina Krefft, Haar, DE;

Emre Topal, Munich, DE;

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H10W 70/60 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 90/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 70/611 (2026.01); H10W 70/685 (2026.01); H10W 74/01 (2026.01); H10W 90/701 (2026.01); H10W 90/724 (2026.01);
Abstract

Integrated bare die packages, and related fabrication methods are disclosed. To provide for the integration of a bare die filter into the bare die package while maintaining an acoustic cavity for the bare die filter and conserving package size, the bare die filter is vertically-integrated with a second component (e.g., another die, a second bare die filter, a passive electrical device(s)). In examples, the bare die filter is vertically-integrated with the second component in a second direction (e.g., vertical direction) orthogonal to the first direction on a first side of a package substrate of the bare die package. The bare die filter and the second component each intersect a common plane in the second direction. In this manner, the expansion in size of the bare die package through the integrated of bare die filter is minimized, while also maintaining the acoustic cavity of the bare die filter.


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