The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2024
Filed:
Mar. 03, 2021
Qualcomm Technologies Inc., San Diego, CA (US);
Rf360 Europe Gmbh, Munich, DE;
Marc Huesgen, Singapore, SG;
Philipp Michael Jaeger, Munich, DE;
QUALCOMM Technologies, Inc., San Diego, CA (US);
RF360 Europe GmbH, Munich, DE;
Abstract
A package that includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, at least one encapsulation layer interconnect located in the encapsulation layer, and a metal layer located over the encapsulation layer. The substrate includes at least one dielectric layer and a plurality of interconnects. The encapsulation layer interconnect is coupled to the substrate. The metal layer is configured as an electromagnetic interference (EMI) shield for the package. The metal layer is located over a backside of the integrated device.