Company Filing History:
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1 out of 13 Years Active: 2016-2024
Title: Inventor Marc Huesgen - Innovator in Electromagnetic Shielding Technologies
Introduction
Marc Huesgen is an accomplished inventor based in Singapore, SG, recognized for his significant contributions to the field of electromagnetic interference (EMI) shielding and heat dissipation technologies. With two patents to his name, he has demonstrated a commitment to innovation in electronics packaging.
Latest Patents
Marc Huesgen's latest patents focus on advancing electronic packaging technologies. His first patent describes a package that comprises a metal layer configured for electromagnetic interference shielding and heat dissipation. This innovative package includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, and a metal layer positioned above the encapsulation layer. The design aims to effectively shield the package from EMI while ensuring optimal heat dissipation. The substrate comprises at least one dielectric layer and multiple interconnects, enhancing the package’s functionality.
His second patent outlines a module and production method that specifies a carrier substrate equipped with electrical wiring, with a component chip mounted using flip-chip technology. This design includes component structures, a supporting frame, and supporting elements that provide electrical connections between the component structures and the carrier substrate. The patent also details a method for producing this advanced module.
Career Highlights
Marc has collaborated with several esteemed companies in the field, notably working with Epcos AG and Qualcomm Technologies, Inc. His experiences at these organizations have shaped his innovation journey and contributed to the development of cutting-edge technologies.
Collaborations
Throughout his career, Marc Huesgen has worked alongside talented individuals such as Kim Choong Lee and Philipp Michael Jaeger. These collaborations have fostered a creative environment that nurtures innovative solutions in technology.
Conclusion
With his patents and collaborative efforts, Marc Huesgen stands as a key figure in the field of electronics innovation, particularly in EMI shielding and heat dissipation solutions. His work continues to influence advancements in electronic packaging, showcasing his commitment to enhancing technological applications in the industry.