The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2016
Filed:
Jun. 15, 2011
Kim Choong Lee, Singapore, SG;
Marc Huesgen, Singapore, SG;
Kim Choong Lee, Singapore, SG;
Marc Huesgen, Singapore, SG;
EPCOS AG, Munich, DE;
Abstract
The invention specifies a module comprising a carrier substrate () having an electrical wiring and a component chip mounted on the carrier substrate () using flip-chip technology, wherein the component chip () has, on its surface () facing the carrier substrate (), component structures (), a supporting frame () and supporting elements (), the supporting elements () produce an electrical connection between the component structures () and the electrical wiring of the carrier substrate (), and the height of the supporting elements and the height of the supporting frame () correspond. Furthermore, the invention specifies a method for producing the module.