Epcos Ag

Qualcomm Technologies, Inc.

Rf360 Europe Gmbh

Marc Huesgen

Philipp Michael Jaeger

Kim Choong Lee

A package that includes a substrate, an integrated device coupled to the substrate, an encapsulation layer located over the substrate, at least one encapsulation layer interconnect located in the encapsulation layer, and a metal layer located over the encapsulation layer. The substrate includes at least one dielectric layer and a plurality of interconnects. The encapsulation layer interconnect is coupled to the substrate. The metal layer is configured as an electromagnetic interference (EMI) shield for the package. The metal layer is located over a backside of the integrated device.

Package comprising metal layer configured for electromagnetic interference shield and heat dissipation

The invention specifies a module comprising a carrier substrate () having an electrical wiring and a component chip mounted on the carrier substrate () using flip-chip technology, wherein the component chip () has, on its surface () facing the carrier substrate (), component structures (), a supporting frame () and supporting elements (), the supporting elements () produce an electrical connection between the component structures () and the electrical wiring of the carrier substrate (), and the height of the supporting elements and the height of the supporting frame () correspond. Furthermore, the invention specifies a method for producing the module.

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Singapore, Singapore

Marc Huesgen