The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 31, 2017

Filed:

Sep. 25, 2014
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Richard S. Withers, Sunnyvale, CA (US);

Ronald B. Koo, Los Altos, CA (US);

Stephen C. Gerber, Austin, TX (US);

Arkadii V. Samoilov, Saratoga, CA (US);

David Johnson, Cupertino, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0002 (2013.01); G01R 27/2605 (2013.01); G06K 9/00053 (2013.01);
Abstract

A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer including at least one through-glass via, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the at least one through-glass via; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the at least one through-glass via; and a protective cover layer disposed on the receive layer.


Find Patent Forward Citations

Loading…