Arjun Kar-Roy

Title: Innovations by Arjun Kar-Roy: A Pioneer in Substrate Vias Technology

Introduction

Arjun Kar-Roy, based in Irvine, California, is a prolific inventor with an impressive portfolio of 22 patents. His work predominantly focuses on advancements in semiconductor technology, particularly in the design and implementation of substrate vias.

Latest Patents

Among his recent innovations is the patent titled "Structure having isolated deep substrate vias with decreased pitch and increased aspect ratio and related method." This invention is noteworthy for its detailed design that comprises a device layer over a buried oxide layer, featuring a deep trench that extends through the device layer. The invention includes a dielectric filler in the deep trench, along with via holes and conductive fillers—specifically, isolated deep substrate vias. The dielectric filler potentially comprises silicon oxide, while the conductive fillers could be tungsten or copper. The innovative aspect of this design includes the capability for adjacent pairs of the isolated deep substrate vias within the deep trench to maintain a pitch of equal to or less than 1.0 microns.

Career Highlights

Arjun has had a remarkable career, contributing his expertise to companies such as Newport Fab, LLC and Conexant Systems, Inc. His continued focus on refining substrate technology has earned him recognition in the field of semiconductor devices.

Collaborations

Throughout his career, Arjun has collaborated with notable colleagues, including David J. Howard and Marco Racanelli. These partnerships have undoubtedly contributed to the development and success of various innovative projects.

Conclusion

Arjun Kar-Roy stands out as a significant contributor to the field of semiconductor technology. With a robust patent portfolio and valuable collaborations, he continues to drive innovation in the industry, shaping the future of electronic device manufacturing.