The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 04, 2016

Filed:

May. 21, 2015
Applicant:

Newport Fab, Llc, Newport Beach, CA (US);

Inventors:

David J. Howard, Irvine, CA (US);

Michael J. DeBar, Tustin, CA (US);

Jeff Rose, Hawthorne, CA (US);

Arjun Kar-Roy, Irvine, CA (US);

Assignee:

Newport Fab, LLC, Newport Beach, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/4763 (2006.01); B81C 1/00 (2006.01); B81B 3/00 (2006.01); H01L 29/417 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00111 (2013.01); B81B 3/007 (2013.01); B81B 2203/0307 (2013.01); B81C 1/00166 (2013.01); B81C 1/00658 (2013.01); H01L 21/47635 (2013.01); H01L 21/76883 (2013.01); H01L 29/417 (2013.01);
Abstract

Self-supported MEMS structure and method for its formation are disclosed. An exemplary method includes forming a polymer layer over a MEMS plate over a substrate, forming a trench over the MEMS plate, forming an oxide liner in the trench on sidewalls of the trench, forming a metal liner over the oxide liner in the trench, and depositing a metallic filler in the trench to form a via. The method further includes removing the polymer layer such that the via and the MEMS plate form the self-supported MEMS structure, where the oxide liner provides mechanical rigidity for the metallic filler of the via. An exemplary structure formed by the disclosed method is also disclosed.


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